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NanoteQ 
MicroFab. Tools 
 

RM98

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Karl Suss MJB3 Mask Aligner

3" masks 300 W 365 nm UV

(1990's) updated with digital imaging new light source and rebuilt staging

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FEI 200M FIB 

Magnum column: 5-30kV, Milling power: 21nA beam current, CDEM for ions and electron images with 7nm resolution. Gas Injection System: 2 injectors. (2005 ISS rebuild 2024)

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Nabity NPGS direct write electron beam lithography system mounted on a JEOL 6330F with an Oxford Inca EDS system for substrate characterization. (2005 system)

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Laurell resist spinner (2020)

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SCS P6700 programmable spinning system (2020)

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DPN 2000 dip pen lithography system (2010)

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TransTemp transparent tube furnace

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Thermo Scientific vacuum oven for processing resist

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VWR vacuum oven general use

Edwards general purpose metals

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Denton general purpose 

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Edwards 304A general purpose

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Kurt Lester Nano 36 AC/DC magnetron sputtering system Multiple targets available. (2015)

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Oxford Plasma pro plus PECVD system with 400 cm platten and 6 gas lines. 300W RF. (2000)

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Oxford Plasma pro plus reactive ion etcher (RIE) with multiple process gases available. (2000)

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e beam evaporator

Kurt Lester Axxis system

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Anatech Hummer X bench top plasma etcher/asher with Ar or O2 process gas

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UVOC ozone cleaner for Si/SiO substrates.

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