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Wake Forest University
Center for Nanotechnology and Quantum Materials
NanoteQ
Packaging Tools
IMF
Westbond 7400A ultrasonic wedge bonder with heated chip holders, and digital imaging system
Westbond 4700E-79 Semi-automatic ultrasonic Ball bonder with heated chip holders, and digital imaging system
UV curing systems, for general curing and spot curing. Sealants can be added to integrated circuits or organic devices.
An assortment of vacuum ovens design for processing epoxy sealants
Kulicke & Soffa 984-6 Plus, 6" Wafer Dicing Saw
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